Data center customers will benefit from access to high-performance silicon solutions that consume less power for AI inference and HPC computing applications -- Esperanto TechnologiesȒ...
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In response to growing customer demand, the Siemens Xcelerator as a Service portfolio will become available on Microsoft Azure, beginning with Siemens' Teamcenter X software for Product...
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X-Silicon aims to address the current limitations of edge computing with its new low-power "C-GPU" architecture. San Diego-based startup X-Silicon recently announced a novel RISC-...
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-- Under a contract with the European Space Agency (ESA), Frontgrade Gaisler is designing a new RISC-V processor tailored to meet the requirements of microcontrollers for the space industry....
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—Andes, HiRain, and HPMicro jointly announced that the three parties will cooperate to combine the AndesCore TM RISC-V processor series, the HPMicro HPM6200 full line of products, an...
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AGL’s latest UCB release advances SDV development and takes a software-first approach with support for AWS Graviton and Toyota Embedded Flutter -- Automotive Grade Linux (AGL), a...
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— Digital Core Design (DCD), a pioneer in semiconductor IP cores, proudly announces the launch of its latest innovation, the DCAN-XL IP Core. Designed to bridge the gap between CAN FD ...
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The rise of quantum computing paints a significant challenge for the cryptography we rely on today. The modern encryption standards we currently use to safeguard sensitive data and communicat...
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A consortium in the US has developed a model of cybersecurity threats to embedded devices, providing a common understanding of these threats with the security mechanisms required for mitigati...
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ADTechnology announces a collaboration with US semiconductor IP specialist ANAFLASH at the Embedded Vision Summit in California, USA, 21-23 May. At the summit, ADTechnology will showcase it...
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13 th May 2024. – T2M IP , to meet the escalating demands for speed, reliability, and efficiency, T2M Technologies are proud to unveil the availability of PCIe 5.0 PHY and Controlle...
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-- M31 Technology Corporation (M31), a leading global provider of silicon intellectual property (IP), announced at today’s earnings conference call (05/09) that the consolidated reven...
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O’Buckley will oversee Intel’s systems foundry growth strategy -- Intel Corporation today announced the appointment of Kevin O’Buckley as senior vice president and gen...
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Qualcomm , a leading American semiconductor company, has recently confirmed that Huawei, a Chinese telecommunications giant, no longer requires its processors. This announcement comes amids...
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VESA releases DisplayHDR version 1.2; more than 3000 display models certified to DisplayHDR standard to date – The Video Electronics Standards Association (VESA ® ) today annou...
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-- Sondrel (AIM: SND), a leading provider of ultra-complex custom chips for leading global technology brands, is pleased to announce that it has won a major ASIC design and supply contract fo...
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Samsung Electronics has completed the design of its 3-nanometer mobile application processor (AP) and successfully achieved its first tape-out through its foundry division. Tape-out is the fi...
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Rapidus Corporation, Japan's high-end microelectronics manufacturer founded in 2022, and Fraunhofer IZM, a world-leading research institute for advanced microelectronic packaging, join fo...
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By Sally Ward-Foxton, EETimes (May 4, 2024) NUREMBERG, Germany— The next generation of Arm’s Ethos micro-NPU, Ethos-U85, is designed to support transformer operations, bringi...
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